A novel chemical patterning technique.
Chemical patterning of surfaces for molecular-based devices or for hybrid organic-semiconductor devices involves a "bottom-up" chemical lithography approach. However, this approach has a relatively low throughput that can be overcome by very high parallelism, which may be expensive and may introduce defects reducing the yield. Various "printing" schemes of such micro-contact nanolithography have been developed that can indeed be scaled to high throughput but are usually limited to a single stage of production and involve contact with the surface, which may affect other chemical processes. The present invention overcomes these issues by using a magnetic mask which creates a pattern of spaced-apart regions of the substrate capable of interacting with magnetic particles.
A "bottom-up’’ strategy employs the spontaneous assembly of building blocks. The present bottom-up method is based on magnetolithography. In this method, a magnetic field is applied on a substrate using paramagnetic metal masks that define the spatial distribution and shape of the applied field, while magnetic nanoparticles interact with the substrate according to the field induced by the mask(s), thus resulting in a chemically patterned substrate.